| 摘要 |
<p>PURPOSE: A semiconductor package is provided to more easily fabricate a chip size package by coating a wafer while a bump is formed in a semiconductor chip of a wafer state. CONSTITUTION: The bump(10) is formed over an input/output terminal(bond pad)(2) of the semiconductor chip(1) of a wafer state. The front and rear of the wafer are spin-coated with a coating solution and are baked to form a coating layer(13), so that the semiconductor chip and the bump are protected. The coating layer of the wafer is ground and polished to expose one end of the bump of the input/output terminal. The end of the exposed bump is plated with an electroconductive material to form a micro input/output terminal(14). The wafer having the coating layer is sawed according to the size of each chip.</p> |
