METHOD FOR REDUCING RESISTIVITY OF ELECTROLESS-PLATED COPPER FILM

摘要

PURPOSE: An electroless copper plating method capable of forming metallization having a low resistivity is provided to form metallization having superior quality by reducing resistivity of electroless-plated copper film. CONSTITUTION: The method for reducing resistivity of electroless-plated copper film comprises the steps of preparing an object to be treated having a copper film formed by electroless plating; and performing posttreatment on the object to be treated to reduce copper oxides contained in the copper film into copper, wherein the posttreatment step comprises the steps of dipping the electrodes into a solution of alkali hydroxide by designating the electroless plated copper film as a processing electrode(122), SCE (saturated calomel electrode) as reference electrode(120), and platinum electrode(124) as relative electrode respectively; and applying a certain voltage for the reference electrode to the processing electrode, and wherein the solution of alkali hydroxide is a solution of potassium hydroxide(110).