| 摘要 |
A semiconductor wafer (1) is scrubbed by a cleaning member (3) made primarily of polyurethane and having micropores in a surface contacting the semiconductor wafer. The micropores has an average diameter ranging from 10 to 200 mu m. The cleaning member (3) may be made of either polyurethane foam or non-woven fabric composed of fibers bound together by urethane resin. Particles that are strongly attached to the surface of a substrate such as a semiconductor wafer can easily be removed by scrubbing. At the same time a substrate is cleaned, surface irregularities and crystalline protrusions on the surface of a substrate such as a semiconductor wafer can be scraped off to adjust the surface roughness of the semiconductor wafer to a desired degree for making the semiconductor wafer surface flat.
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