发明名称 |
Method of manufacturing modules with an integrated circuit |
摘要 |
In a method of manufacturing modules (4), each with at least one integrated circuit (2), the integrated circuits (2) are separated from a previously manufactured circuit configuration (1), which is in the form of a flexible film comprising a plurality of integrated circuits (2) on the basis of a polymer, by a combined stamping-vacuum conveying device (6), after which each of the separated integrated circuits (2) is conveyed to a module substrate (5) and connected to the module substrate (5) so as to form a module (4).
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申请公布号 |
US2003087474(A1) |
申请公布日期 |
2003.05.08 |
申请号 |
US20020281691 |
申请日期 |
2002.10.28 |
申请人 |
BRUGGER CHRISTIAN;FRITZ REINHARD;DE LANGE ANTHONIE ARIE;VAN ROOSMALEN JOHANNES HENRICU;WEEKAMP JOHANNUS WILHELMUS |
发明人 |
BRUGGER CHRISTIAN;FRITZ REINHARD;DE LANGE ANTHONIE ARIE;VAN ROOSMALEN JOHANNES HENRICUS MARIA;WEEKAMP JOHANNUS WILHELMUS |
分类号 |
H01L21/52;G06K19/07;G06K19/077;H01L21/00;H01L21/60;H01L21/683;H01L25/04;H01L27/00;H01L27/28;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L21/82 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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