发明名称 |
Resin-coated copper foil, and printed wiring board using resin-coated copper foil |
摘要 |
An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: where R is H or
|
申请公布号 |
US2003087101(A1) |
申请公布日期 |
2003.05.08 |
申请号 |
US20020156339 |
申请日期 |
2002.05.24 |
申请人 |
SATO TETSURO;ASAI TSUTOMU;MATSUSHIMA TOSHIFUMI |
发明人 |
SATO TETSURO;ASAI TSUTOMU;MATSUSHIMA TOSHIFUMI |
分类号 |
B32B15/08;C08G59/62;C08L61/10;C08L63/00;C08L101/00;C09D163/00;H05K1/03;H05K3/46;(IPC1-7):B32B27/38 |
主分类号 |
B32B15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|