发明名称 SUBSTRATE INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate inspection device that has a simple constitution and can promote the miniaturization of printed wiring boards to be inspected. SOLUTION: A flexible printed wiring board 11 is inspected through an inspecting flexible printed wiring board 23 provided with an inspection pattern 23 electrically connected to the connection pattern 111 of the printed wiring board 11 by placing the wiring board 23 on the receiving base 20 of the main body 26 of this substrate inspection device and connecting the connection pattern 111 of the wiring board 11 to the inspection pattern 24 of the wiring board 23 placed on the receiving base 20.
申请公布号 JP2003130908(A) 申请公布日期 2003.05.08
申请号 JP20010326683 申请日期 2001.10.24
申请人 OLYMPUS OPTICAL CO LTD 发明人 KOSHINOU AKIHIRO;SUGITA YUKIHIKO
分类号 G01R31/02;G01R1/00;H05K1/16;H05K3/00;(IPC1-7):G01R31/02 主分类号 G01R31/02
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