发明名称 INJECTION/EXPANSION MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an injection/expansion molding method by which it is possible to control not only the expansion ratio but also the thickness of a hardened layer, and also mold an expanded product best-suited for a used application and further, restrain the property dispersion of the expanded product, so that the failure rate of the finished product is reduced. SOLUTION: This injection/expansion molding method comprises the steps to inject a molten resin 9 into a cavity 6 formed in a mold 1, and expand the molten resin 9 by moving a movable half 5 of the mold 1 after the resin injection/packing process. In this method, the internal temperature of the mold 1 is detected by means of a mold temperature sensor 10, then the internal resin temperature 9a of the cavity 6 is estimated based on the actual measurements of the detected temperature, and the inching of the mold 1 is delayed until a temperature at which the expansion-molded product with a specified expansion ratio and a specified hardened layer thickness can be obtained. Further, after that resin temperature is reached, the movable half 5 of the mold 1 is moved backward.
申请公布号 JP2003127194(A) 申请公布日期 2003.05.08
申请号 JP20010323167 申请日期 2001.10.22
申请人 MITSUBISHI HEAVY IND LTD 发明人 TODA NAOKI;KARIYA TOSHIHIKO;NISHIMURA WATARU
分类号 B29C45/56;B29C45/80;B29K105/04;(IPC1-7):B29C45/56 主分类号 B29C45/56
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