| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor device, satisfying moldability (fluidity and fillability) and, at the same time, reliability especially high temperature reflow reliability, and to provide a semiconductor device. SOLUTION: This epoxy resin composition comprises an epoxy resin (A), a curing agent (B) and an inorganic filler (C) and is characterized by containing, as the epoxy resin (A), an epoxy resin (a1) represented by the general formula (I) as the essential component. Moreover, the epoxy resin composition is characterized by containing >=10 wt.% epoxy resin (a1) based on the whole epoxy resin (A).
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