| 摘要 |
<p>A method and apparatus for pre-conditioning a polishing pad (12) for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member (20) having a smooth surface, pressing the pre-conditioning member (20) against the polishing pad (12) while moving the polishing pad (12), and flattening the surface of the polishing pad (12) until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.</p> |
