Sondennadel zum Testen von Halbleiterchips und Verfahren zu ihrer Herstellung

摘要

The invention relates to a probe needle for testing semiconductor chips, one end of said probe needle being fixed in a holding element and the free end thereof comprising a contact tip. The invention also relates to a method for producing a probe needle for testing semiconductor chips, said method comprising a plurality of treatment steps for forming the probe needle. The aim of the invention is to increase the service life of probe needles. To this end, the probe needle is provided - at least on the surface of the contact tip - with a layer consisting of a chemically inert, electroconductive material which is hard in relation to the material of contact surfaces of the semiconductor chips.