CONTACT PLANARIZATION MATERIALS THAT GENERATE NO VCONTACT PLANARIZATION MATERIALS THAT GENERATE NO VOLATILE BYPRODUCTS OR RESIDUE DURING CURING OLATILE BYPRODUCTS OR RESIDUE DURING CURING

摘要

The present invention is directed towards planarization materials that produ ce little or no volatile byproducts during the hardening process when used in contact planarization process. The materials can be hardened by photo- orradiation or by heat during the planirization process, and they include on e or more types of monomers, oligomers, or mixtures thereof, an optional cross - linker, and an optional organic reactive solvents. The solvent, if used, is chemically reacted with the monomers or oligomers and thus becomes part of t he polymer matrix during the curing process. These materials can be used for damascene, dual damascene, bi-layer, and multi-layer applications, microelectromechanical system (MEMS), packaging, optical devices, photonics, optoelectronics, microelectronics, and sensor devices fabrication.