PLATING APPARATUS AND PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To facilitate the formation of a more homogeneous plating film on the surface to be plated of a material to be treated. SOLUTION: The plating apparatus has a holding section 12 which holds an upwardly turned material W by sealing the outer edge of the surface to be plated, a heating-fluid holding section 40 which holds a heating fluid which is brought into contact with the material W held by the holding section 12 to heat the material W, and a plating liquid supply section 62 which supplies a plating liquid 60 to the surface to be treated of the material W held by the holding section 12.