| 摘要 |
PROBLEM TO BE SOLVED: To obtain a water-soluble surface treatment agent which is excellent in heat resistance, does not damage the good solder wettability of copper or a copper alloy even when heated, and hardly allows an oxidized surface film to be formed on the surface of copper or a copper alloy even after the surface is exposed to high temperature and humidity. SOLUTION: This surface treatment agent contains 0.01-50 g/L at least one compound selected from among benzimidazole derivatives having oxy compounds bonded thereto and represented by formulas (1)-(3) (wherein, X and Z are each alkyl, alkenyl, alkynyl, aryl, aralkyl, halogen or hydrogen; Y is alkylene, alkenylene, alkynylene, arylene or aralkylene; a is 0-4; b is 0 or 1; and c is an integer of 0-7).
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