发明名称 METHOD FOR DEMOLDING INORGANIC SUBSTRATE AFTER PRESSURE MOLDING AND DEMOLDING APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a method for demolding an inorganic substrate, capable of demolding the inorganic substrate from a press mold in a short time in a pressure molding process for the inorganic substrate without deforming the inorganic substrate or generating a demolding crack after pressure molding. SOLUTION: The inorganic substrate is demolded from the press mold by sucking the bottom surface of the inorganic substrate under reduced pressure after pressure molding.
申请公布号 JP2003127125(A) 申请公布日期 2003.05.08
申请号 JP20010325609 申请日期 2001.10.23
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HAGIMOTO YOSHIAKI
分类号 B28B7/00;B28B13/06;(IPC1-7):B28B13/06 主分类号 B28B7/00
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