| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing which simultaneously satisfies moldability (fluidity and filling property) and reliability, especially reflow reliability at a high temperature and to provide a semiconductor device. SOLUTION: In this epoxy resin composition which contains (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, a curing agent (b1) represented by formula (I) below is contained as the curing agent (B). An epoxy resin composition in which the epoxy resin (A) contains an epoxy resin (a1) represented by formula (II) is also provided.
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