| 摘要 |
<p>In one embodiment of the invention, a stacking element (120k) includes a printed circuit board (PCB) (210) and a plurality of solder bumps (242, 244). The PCB (210) has a top side (213) and a bottom side (215). The top side (213) is attached to first pins of a first device (110k). The plurality of solder bumps (242, 244) are on the bottom side (215) and attached to upper areas of second pins (272, 274) of a second device (110k+1) to provide electrical connections between the first pins and the second pins (272, 274).</p> |
