发明名称 |
Process for drilling holes in connecting support for electrical components includes coating support with heat resistant material and removing and vaporizing and/or liquefying coating material and support material in the hole to be drilled |
摘要 |
Process for drilling holes in a connecting support made from insulating material comprises: coating surface of support on beam inlet side and/or optionally on beam outlet side with soluble heat resistant material (8, 9); removing and vaporizing and/or liquefying coating material and support material in the hole to be drilled using an energy beam; and removing coating from support surface. Preferred Features: The energy beam used is a laser beam. The coating is applied by spraying, immersing or casting. The coating is removed using ultrasound. The coating is a photoresist, water glass, a pectin solution, gelatin, a paste or a solder stop lacquer.
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申请公布号 |
DE10202923(A1) |
申请公布日期 |
2003.05.08 |
申请号 |
DE20021002923 |
申请日期 |
2002.01.25 |
申请人 |
SIEMENS DEMATIC AG |
发明人 |
BACH, CHRISTIAN;DREISIGACKER, UWE;HILLEBRAND, DIRK;ROTHACHER, PETER |
分类号 |
H01L21/48;H05K3/00;(IPC1-7):H05K3/00;H01L23/50;H01L21/60 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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