发明名称 Process for drilling holes in connecting support for electrical components includes coating support with heat resistant material and removing and vaporizing and/or liquefying coating material and support material in the hole to be drilled
摘要 Process for drilling holes in a connecting support made from insulating material comprises: coating surface of support on beam inlet side and/or optionally on beam outlet side with soluble heat resistant material (8, 9); removing and vaporizing and/or liquefying coating material and support material in the hole to be drilled using an energy beam; and removing coating from support surface. Preferred Features: The energy beam used is a laser beam. The coating is applied by spraying, immersing or casting. The coating is removed using ultrasound. The coating is a photoresist, water glass, a pectin solution, gelatin, a paste or a solder stop lacquer.
申请公布号 DE10202923(A1) 申请公布日期 2003.05.08
申请号 DE20021002923 申请日期 2002.01.25
申请人 SIEMENS DEMATIC AG 发明人 BACH, CHRISTIAN;DREISIGACKER, UWE;HILLEBRAND, DIRK;ROTHACHER, PETER
分类号 H01L21/48;H05K3/00;(IPC1-7):H05K3/00;H01L23/50;H01L21/60 主分类号 H01L21/48
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