发明名称 EMBOSS PROCESS APPARATUS AND MANUFACTURING METHOD FOR CARRIER TAPE
摘要 PROBLEM TO BE SOLVED: To provide an emboss process apparatus and a manufacturing method for a carrier tape, by which ribs, which are the joints of embossed parts housing electric equipment, are shortened so that the number of electric equipment to be housed can be increased. SOLUTION: In the emboss process apparatus for the carrier tape, the long tape is intermittently transferred per a pitch, heated at a heating section, and embossed at a molding section, where a heat insulation section of one pitch length is provided between the heating section and the molding section. According to the manufacturing method for the carrier tape, the long tape is intermittently transferred per a pitch, heated at the heating section, kept warm at the heat insulation section after having been heated, and embossed at the molding section. At the heating section, heating plates heats the tape having a length of one pitch plus one portion of the rib. As a result, the rib of the tape, which is the joint between the pitches molded with heat, is heated twice by the rear end and front end of the heat plate.
申请公布号 JP2003128007(A) 申请公布日期 2003.05.08
申请号 JP20010319157 申请日期 2001.10.17
申请人 SUMITOMO BAKELITE CO LTD 发明人 OTSUKA HIROSHI
分类号 B29C35/04;B29C35/08;B29C51/08;B29C51/18;B29C51/26;B29C51/42;B29L7/00;B65B15/04;B65B47/02;B65B47/08;H01L21/00;H05K13/00;(IPC1-7):B65B15/04 主分类号 B29C35/04
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