| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which has excellent heat resistance, dielectric characteristics and adhesiveness, to provide a prepreg, and to provide a laminate. SOLUTION: This resin composition which is impregnated into a substrate to form a sheet-like prepreg is characterized by containing a benzocyclobutene resin and/or its prepolymer, and a bismaleimide compound. The prepreg is characterized by impregnating the substrate with the resin composition. The laminate is characterized by laminating one or more prepreg and heating and pressurizing the laminate. |
