发明名称 Three-dimensional polymer nano/micro molding by sacrificial layer technique
摘要 A procedure is presented herein for formation of NEMS/MEMS components and systems with direct arbitrary three-dimensionality for the first time in NEMS/MEMS fabrication. This method leads also to a simple and effective external "quick-connection" interconnect scheme where ordinary fused silica tubes may be press-fitted into the surface opening of this system to withstand high pressure. This method may be extended for connection of multiple levels of polymer fluidic motherboards together using small sections of fused silica tubing, with no loss of stacking volume because of the lack of any connector lips or bosses. This scheme gives the flexibility of allowing multiple stacks of polymeric 3-D components (motherboards) while being able to control the channel lengths within the stacks as desired. Mixing chambers can also be molded in a single silicone elastomer (or other material) layer, because true three-dimensionality is trivially possible without the complexity of multi stacked lithography.
申请公布号 US2003087198(A1) 申请公布日期 2003.05.08
申请号 US20020246610 申请日期 2002.09.18
申请人 DHARMATILLEKE SAMAN MANGALA;HENDERSON H. THURMAN 发明人 DHARMATILLEKE SAMAN MANGALA;HENDERSON H. THURMAN
分类号 G03F7/00;(IPC1-7):G03F7/00 主分类号 G03F7/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利