| 摘要 |
<p>The present invention provides a method and an apparatus for cleaning substrates. The cleaning chamber (102) defines a processing cavity (114) adapted to accommodate a substrate (616) therein. In one embodiment, the cleaning chamber (102) includes a chamber body having a processing cavity (114) defined therein. A substrate (616) is disposed in the processing cavity (114) without contacting other chamber components by a Bernoulli effect and/or by a fluid cushion above and/or below the substrate. Fluid is flowed into the processing cavity (114) at an angle relative to a radial line of the substrate (616) to induce and/or control rotation of the substrate during a cleaning and drying process.</p> |
