Verfahren zum Montieren eines elektronischen Bauteils auf einem Leitersubstrat und elektronische Vorrichtung unter Verwendung dieses Montierungsverfahrens

摘要

An insulating film 3 is provided with an opening 4 whose size is equivalent to or slightly smaller than the outer configuration of electronic component 5. A conductive pattern 2 is formed on insulating substrate 1. After forcibly inserting the main body of electronic component 5 into said opening 4, terminals 6 are put between insulating film 3 and insulating substrate 1 and disposed in such a manner that terminals 6 are brought into contact with conductive pattern 2. Then, insulating film 3 is connected with insulating substrate 1 by soldering them in a region surrounding terminals 6, thereby firmly fixing terminals 6 of electronic component 5 on conductive pattern 2.