发明名称 MOLD COOLING DEVICE
摘要 A mold cooling device is provided that has no danger of cooling water flowing out into the cooling hole of the mold after completion of air purging and that can severely effect temperature control of the mold. Accordingly, in the invention, the mold cooling device comprises a fluid confluence 4 where a cooling water feed path 2 for feeding cooling water into a cooling hole A1 formed in the mold A meets an air purge path 3 for feeding high pressure air to air-purge the cooling water in the cooling hole, the cooling water and air being alternately fed into the cooling hole to thereby cool the mold through the fluid confluence, wherein the fluid confluence 4 has check valves 4a, 4b incorporated therein whereby cooling water and air of lower pressure than the cracking pressure are maintained in the cooling water feed path and in the air purge path, respectively, it being arranged that high pressure air is delivered from the air purge path 3 through the fluid confluence with a time lag after the delivery of cooling water from the cooling water feed path 2 through the fluid confluence 4.
申请公布号 WO03037547(A1) 申请公布日期 2003.05.08
申请号 WO2002JP11269 申请日期 2002.10.30
申请人 AHRESTY CORPORATION;KOMAKI, SHIGEYOSHI 发明人 KOMAKI, SHIGEYOSHI
分类号 B22C9/06;B22D17/22;B29C33/04;(IPC1-7):B22C9/06 主分类号 B22C9/06
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