| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-plating process allowing little generation of defects such as void and a plated product. SOLUTION: In the copper-plating process, copper-plating is applied to at least a portion of a substrate surface. The process comprises a step wherein the substrate is pre-plated through electroplating using a pre-plating solution containing sulfuric acid and copper sulfate and a step wherein the pre-plated substrate is subjected to final plating. Here, the copper concentration in the pre-plating solution is >=0.6×(64/250)×CS [g/l], provided that CS [g/l] is the solubility of copper sulfate pentahydrate in the pre-plating solution from which the copper sulfate (copper sulfate pentahydrate) is excluded. Preferably, the copper concentrations in the pre-plating solution C1 [g/l] and in the final plating solution C2 [g/l] satisfy the formula: C1 >C2 .
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