MANUFACTURING METHOD AND SUBSTRATE FOR LIQUID EJECTION HEAD, AND PROCESSING METHOD FOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To accurately open an ink supply port which passes through an Si substrate by an anisotropic etching. SOLUTION: The ink supply port 9 is opened in the Si substrate 1 wherein ink ejection energy generating elements 2 are formed by applying the anisotropic etching from the rear side being the opposite side surface where the ink ejection energy generating elements 2 are formed. When the anisotropic etching is applied, OSF (oxidation-induced stacking faults) of OSF density 2×10<4> pieces/cm<2> or more and the OSF length 2μm or more is made to exist on the rear surface of the Si substrate 1.