| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum treatment method that can effectively reduce impurities in a plasma treatment space without complicating a process or an apparatus. SOLUTION: This vacuum treatment method is the one that plasma-treats a substrate 119 by introducing a plasma treatment gas into a reaction vessel 110 containing the substrate 119 and supplying an electric power for generating a plasma, wherein, prior to the plasma treatment of the substrate 119, the substrate 119 is heated with the plasma generated by feeding a heating gas and an electric power into the vessel 110, and the ultimate temperature Th ( deg.C) of the inside wall of the vessel 110 during heating the substrate 119 is higher than the ultimate temperature Tp ( deg.C) of the inside wall of the vessel 110 during plasma-treating the substrate 119.
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