发明名称 METHOD OF CLEAVING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of cleaving a substrate free of contamination in the manufacture of a liquid crystal display device. SOLUTION: The method of cleaving a substrate comprises a step of inscribing a cleaving line 10 on a place to be cleaved on a lower substrate 12, a step of securing an upper substrate 11 and the lower substrate 12 with glue 13, and a step in which the lower substrate 12 is cleaved in two along the cleaving line 10 by the action of stress caused by air pressure provided through the upper substrate 11.
申请公布号 JP2003127099(A) 申请公布日期 2003.05.08
申请号 JP20020233449 申请日期 2002.08.09
申请人 HANNSTAR DISPLAY CORP 发明人 CHUANG TA-KO;TANAKA SAKAE
分类号 B26F3/04;G02F1/1333;(IPC1-7):B26F3/04 主分类号 B26F3/04
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