| 摘要 |
A photosensitive resin composition according to the invention includes (A) a photosensitive resin, (B) an epoxy resin, (C) a photopolymerization initiator, and (D) a polymerizable unsaturated compound and/or a solvent, which photosensitive resin (A) is obtained by allowing an epoxy resin (a) to react with a compound (b) having one primary alcoholic hydroxyl group and one functional group selected from a carboxyl group and a secondary amino group per molecule and an unsaturated monobasic acid (c) to yield a reaction product (I) and allowing a saturated or unsaturated polybasic acid anhydride (d) to react with the reaction product (I). The photosensitive resin composition of the invention is used as a solder resist in printed circuit boards, can be satisfactorily developed in a dilute basic aqueous solution and can yield a cured film that is excellent in flexibility, water resistance, adhesion, solder heat resistance, electroless gold plating resistance and pressure cooker test (PCT) resistance.
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