| 发明名称 |
SEMICONDUCTOR STRUCTURE WITH A COIL UNDERNEATH THE FIRST WIRING LAYER OR BETWEEN TWO WIRING LAYERS |
| 摘要 |
A semiconductor structure comprising a component layer made of a semiconductor material , a dielectric layer (12) arranged above the component layer (2), a wiring layer (14) arranged on the dielectric layer (12) and a coil (60) which is arranged in the dielectric layer (12) and which is connected to contacts (66,68) in the wiring layer (14). |
| 申请公布号 |
WO03038899(A2) |
申请公布日期 |
2003.05.08 |
| 申请号 |
WO2002EP11756 |
申请日期 |
2002.10.21 |
| 申请人 |
INFINEON TECHNOLOGIES AG;GOLLER, KLAUS |
发明人 |
GOLLER, KLAUS |
| 分类号 |
H01L21/02;H01L23/522;H01L27/08 |
主分类号 |
H01L21/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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