| 摘要 |
<p>A method for releasing a resist which comprises contacting a wiring board having a residual resist film with a resist releasing fluid under an atmosphere having an oxygen content of 2 vol % or less. The above treatment for releasing a resist is preferably carried out after the residual resist film is pre-treated with hydrogen peroxide. In the method, a resist releasing fluid containing an amine compound, a solvent, a strong alkali and water is preferably used.</p> |
