| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor for improving the degree of freedom in a packaging direction. SOLUTION: The semiconductor pressure sensor has a semiconductor substrate having a diaphragm section that is formed flexibly. Additionally, the semiconductor pressure sensor comprises a sensor chip 1 for outputting an electric signal according to the deflection of a diaphragm section that is generated by pressure from the outside and an equipment body 10 that is formed as a microwave circuit molding, forms an accommodation recess 11 for accommodating the sensor chip 1 on one surface, and at the same time forms a pressure inlet section 12 for introducing a fluid whose pressure is to be detected to the diaphragm section on the bottom surface of the accommodation recess 11. A plurality of electrodes that the sensor chip 1 has and a plurality of conductive patterns 14 that are electrically connected each are formed on the surface of the equipment body 10. Each conductive pattern 14 is extended to two opposing side surfaces of the equipment body 10 in the normal direction of the pressure introduction inlet 12. Then, sites that are extended to the two sides are set to be terminals 14a and 14b to be connected to a packaging substrate.
|
