发明名称 MOLD DEVICE
摘要 PROBLEM TO BE SOLVED: To aim at providing a mold device which does not change a thickness of processed material by drawing and performs a reverse drawing with a prescribed shape and thickness. SOLUTION: The device comprises an upper mold having a reverse drawing punch 32 on the top of which a processing part 41 is installed for a reverse drawing of workpieces, a pin 33 the lower end of which contacts with a driver 50 installed on the lower mold to check and push down, a lower mold having a processing hole 42 opposite to the processing part 41 of the reverse punch 32, and a push-up pin 44 which is energized upward through the driver 50, moves up and down freely and holds or pushes up a processed material 43 by having the upper end contact with the processed material 43 drawn by getting through the processing hole 42.
申请公布号 JP2003126924(A) 申请公布日期 2003.05.08
申请号 JP20010324722 申请日期 2001.10.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORITA HIDEO;ONISHI TSUTOMU
分类号 B21D28/00;B21D28/16;B21D45/08;(IPC1-7):B21D28/00 主分类号 B21D28/00
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