发明名称 |
MIKROPORÖSER KUPFERFILM UND LÖSUNG FÜR STROMLOSE KUPFERPLATTIERUNG ZUR HERSTELLUNG DERSELBEN |
摘要 |
A copper metal film having 10<5> to 10<9> micropores per square centimeter and a product plated with the film. The copper metal film is obtained by immersing a work in an electroless plating solution which contains copper ions, a complexing agent, a hypophosphorus acid compound, a metal catalyst for initiating reduction, and a compound having an acetylenic bond. <IMAGE> |
申请公布号 |
DE69807658(T2) |
申请公布日期 |
2003.05.08 |
申请号 |
DE1998607658T |
申请日期 |
1998.02.19 |
申请人 |
EBARA-UDYLITE CO. LTD., TOKIO/TOKYO;HONMA, HIDEO |
发明人 |
HONMA, HIDEO;FUJINAMI, TOMOYUKI;EBINA, NOBUO |
分类号 |
C23C18/40;(IPC1-7):C23C18/40 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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