| 摘要 |
PROBLEM TO BE SOLVED: To reliably embed a metal film in a concave part for circuit formation on a substrate to be plated through a electroplating. SOLUTION: The electric current that flows in a first working electrode 152 wherein the electrode body part is exposed by a first aperture 152b is determined in a plating solution 161, while the electric current that flows in a second working electrode 153 wherein the electrode body part is exposed by a second aperture 153b is determined in the plating solution 161. Here, the second aperture 153b has a larger area than the first aperture 152b. Next, based on each aperture area and the determined current value, ratio C/A is calculated, wherein C and A are the current densities in the first and second working electrodes 152 and 153, respectively. The ratio C/A is compared to a predetermined value K, and if the ratio C/A is smaller than the predetermined value K, the plating solution 161 is completely or partially exchanged with a new plating solution. |
