| 摘要 |
PROBLEM TO BE SOLVED: To provide an Sn-plating process that inhibits whisker generation, which meets the requirement of Pb-removal from Sn-Pb solders conventionally used for external plating of semiconductors in view of environmental issues and solves the problem associated with the use of Pb-free and Sn-only solders, where reliability cannot be retained due to short circuit caused by whisker development during use. SOLUTION: In Sn-solder plating, the final plating process is performed with an alternating current of at least 10 Hz, especially >=100 Hz, while controlling the minimum current at <=0. |
