| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin molded product capable of being formed by precision molding so as to cope with miniaturizing and thinning of an electronic device, and capable of satisfying a requirement for high resistance to heat of soldering (resistance to reflow soldering). SOLUTION: This heat-resistant crosslinked polyester resin molded product is obtained by subjecting a resin composition consisting mainly of a thermoplastic polyester resin to melt molding, then to irradiation with ionizing radiation so as to crosslink the composition, wherein the thermoplastic polyester resin is mainly composed of repeating units of (1) an aromatic dicarboxylic acid component such as terephthalic acid and dimethyl terephthalate, (2) a saturated aliphatic diol component such as 1,4-butanediol, and (3) an unsaturated dicarboxylic acid component in which a carbon-carbon double bond exists atα- andβ-positions to carbonyl functional groups such as dimethyl fumarate, and further the copolymerization ratio of (3) the unsaturated dicarboxylic acid component in which the carbon-carbon double bond exists at theα- andβ- positions to the carbonyl functional groups is 1-20 mol%. |
