| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device having high connection reliability even in soldering using a lead-free solder. SOLUTION: The device is provided with a soldering tank 6 which jets a molten lead-free solder 10 upward, a transporting conveyor 3 which transports a component mounting board 9 so as to pass through upward of the soldering tank 6 and contacts the lower face of the component mounting board 9 with the molten lead-free solder 10, and a heater 8 for component mounting face which is arranged roughly in the upward of the soldering tank 6 and heats the upper face side of the component mounting board 9. As a result, solderability of a soldering part can be ensured and the generation of surplus solder can be suppressed. |
