| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor sealing which has a high complex magnetic permeability in a high frequency range, good resin fluidity and enables electromagnetic shielding of a high frequency semiconductor device and to provide a semiconductor device. SOLUTION: This epoxy resin composition contains as an essential component (A) an epoxy resin, (B) a curing agent, (C) a magnetic powder and (D) a curing accelerator. The magnetic powder (C) has a specific magnetic permeability of 50-3,000 and is contained occupying 30-90 vol.% of the whole epoxy resin composition.
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