发明名称 ONE-PACK MOISTURE-CURABLE FLEXIBLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a one-pack moisture-curable composition capable of improving storage stability without deteriorating curability for mutually conflicting performances such as the storage stability and curability, curable at normal temperature and having flexibility after curing. SOLUTION: This one-pack moisture-curable composition is obtained by compounding a silyl compound having a hydrolyzable silyl group with a curing catalyst for the hydrolyzable silyl group, an epoxy resin and a ketimine compound prepared by reacting a carbonyl compound represented by chemical formula (2) (wherein, R4 and R5 are any one alkyl group selected from the group consisting of 2-6C alkyl groups and may be the same or different) with an amine compound having primary amino group and represented by chemical formula (3) (wherein, R6 is a residue except the primary amino group of the amine compound; and n is an integer of >=1).
申请公布号 JP2003128756(A) 申请公布日期 2003.05.08
申请号 JP20010319709 申请日期 2001.10.17
申请人 KONISHI CO LTD 发明人 SUZUKI KENTARO;MATSUURA NOBUTERU;HORII KYUICHI
分类号 C09K3/10;C08G59/56;C09D133/00;C09D163/00;C09D171/00;C09D183/04;C09J133/00;C09J163/00;C09J171/00;C09J183/04;(IPC1-7):C08G59/56 主分类号 C09K3/10
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