| 摘要 |
<p>A substrate transfer apparatus for transferring a substrate on which electronic parts are mounted, inexpensively and reliably while preventing any of the electronic parts from coming off and the substrate from being damaged. The substrate transfer apparatus (10) is equipped with an arm body (11) which can move vertically and transversely. To the arm body (11), there are attached a plurality of glass substrate suction pads (12) for vacuum-chucking and supporting the upper face of a glass substrate (21), and a plurality of electronic part suction pads (13) arranged above the electronic parts (22) in positions corresponding to those of the electronic parts and adapted to vacuum-chuck and support the upper faces of the electronic parts (22). Each of the suction pads (12, 13) is connected to a vacuum source through a suction line. Each suction pad (12, 13) is equipped with an adjusting mechanism for adjusting its position relative to the arm body (11), so that its mount position on the arm body (11) can be adjusted in accordance with the size and position of the glass substrate (21) or the electronic parts (22). Each suction pad (13) is equipped with a spring (15) for absorbing an impact which is applied to the electronic part (22) when the suction pad (13) contacts with the electronic part (22).</p> |
