| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminated plate having a low dielectric constant and a low dielectric tangent by a glass epoxy substrate, and is easy of production, molding, adhesion, multi-layer processing, processability, etc., in relation to a polytertrafluoroethylene substrate and a PPE substrate. SOLUTION: When the glass epoxy copper-clad laminated plate is produced by laminating a plurality of prepregs in which a glass base material is impregnated with an epoxy resin composition and dried and integrally molding the prepregs with copper foil laid at least on one side of the laminate to overlap each other, an epoxy resin varnish containing the epoxy resin (A), a curing agent (B), and a fullerene or its homologue (C60 , C70 , a carbon nanometer tube, etc.), (C) as indispensable components in a ratio of 5-50% of (C) to [(A)+(B)] is used. |
