| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having low-temperature curability at <=0 deg.C, short in tack-free time and scarcely leaving tackiness. SOLUTION: This curable resin composition comprises a resin component with the content ratio: oxirane ring/thiirane ring of (95:5) to (0:100) and a modified xylene resin bearing at least one kind of group selected from hydroxy, amino and carboxy groups; wherein it is more preferable that the modified xylene resin is such that at least one resin selected from the group consisting of nonvolak-type phenolic resin, alkylphenolic resin and phonelics is incorporated in a xylene resin.
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