发明名称 |
Semiconductor packages for semiconductor devices |
摘要 |
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die having a vertical power transistor, a first surface and a second surface. A ground plane proximate the second surface and distal to the first surface. A bus member covers a portion the first surface of the semiconductor die and has at least one leg that electrically couples a source region of the semiconductor die to the ground plane.
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申请公布号 |
US2003085464(A1) |
申请公布日期 |
2003.05.08 |
申请号 |
US20010052945 |
申请日期 |
2001.11.02 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
LANG DENNIS |
分类号 |
H01L23/50;(IPC1-7):H01L23/485;H01L31/113 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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