发明名称 |
Method for cutting tape carrier packages of a LCD and LCD structure |
摘要 |
A cutting method of a tap carrier package of a liquid crystal display. The cutting method cuts a film comprising a first straight layout along a predetermined direction on a wiring layer comprising a second straight layout along the predetermined direction and a oblique layout, the method comprises the following steps. First, a breach is formed by cutting apart of the first straight layout on the film. Finally, the film is fastened on the wiring layer. Thus, the remaining first straight layout is only connected to the straight layout and the oblique layout is exposed through the breach.
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申请公布号 |
US2003086047(A1) |
申请公布日期 |
2003.05.08 |
申请号 |
US20020227263 |
申请日期 |
2002.08.23 |
申请人 |
LEE CHI-TIEN;HUANG JIUNN-YAU;LIN MEI-HUI;LEE DEUK-SU |
发明人 |
LEE CHI-TIEN;HUANG JIUNN-YAU;LIN MEI-HUI;LEE DEUK-SU |
分类号 |
G02F1/1345;H05K1/11;H05K3/36;(IPC1-7):G02F1/134 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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