Oxygen-doped silicon carbide etch stop layer

摘要

A low-k (k<4.2) oxygen-doped SiC layer acts as an etch stop layer for dual-damascene applications. A dual-damascene structure includes: a base layer; a first dielectric layer formed on the base layer; an oxygen-doped silicon carbide etch stop layer formed on the first dielectric layer; and a second dielectric layer formed on the etch stop layer. The second dielectric layer is deposited by using a chemical vapor deposition (CVD) method. The novel oxygen-doped etch stop layer presents a lower dielectric constant (k~4.1), better mechanical properties, and improved electrical properties.