发明名称 POLISHING PADS AND MANUFACTURING METHODS
摘要 <p>Disclosed is a method of manufacturing polymer materials having properties that are determined by selected process conditions. The properties can be modified for a variety of applications. Exemplary applications are pads for chemical mechanical planarization of substrates and pads for polishing substrates. One embodiment of the method includes the steps of providing a polymer sheet having a substrate contacting area, heating the area a sufficient amount, and applying a sufficient amount of mechanical pressure to the area during at least a portion of the heating step to achieve the desired properties for the material.</p>
申请公布号 WO2003037565(A2) 申请公布日期 2003.05.08
申请号 US2002034618 申请日期 2002.10.29
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