Encapsulating electrical component e.g. SAW device including chip, by laminated film on carrier surface on which chip is mounted, enclosing in plastics compound and hardening

摘要

The chip has component structures on its front side. The component is mounted using flip-chip technology onto the surface of a carrier and connected to electrical pads arranged there, the front side of the chip facing the carrier and spaced apart from it. A film is laminated on the entire surface of the carrier on which the chip is mounted. A plastics compound in liquid form is applied to enclose the carrier and hardened. An Independent claim is also included for a surface acoustic wave device.