发明名称 INJECTION MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem that because of various factors of uselessness, a conventional injection molding device shows an increased manufacturing cost and requires a large installation space, hence the inability to perform a highly efficient injection molding operation. SOLUTION: The injection molding device comprises a fixed platen 17 to which a heating cylinder 13 is connected, a cavity side half holder 34 which is connected to the platen 17 with a cavity side half 24 mounted, a compression coil spring 49 which urges the cavity side half holder 34 so that the holder 34 is set apart from the fixed platen 17, a movable half holder 31 which is positioned opposite to the fixed platen 17 with the cavity side half holder 34 set in between and to which a movable template 30 is fitted, and a mold clamping cylinder 32 for generating a mold clamping force which has the connected movable half holder 31 and drives the holder 31 in an opposite direction to the fixed platen 17, and superposes the fixed platen 17, the cavity side half holder 34 and the movable half holder 31 in a tight adhesion state against the urging force of the compression coil spring 49.
申请公布号 JP2003127198(A) 申请公布日期 2003.05.08
申请号 JP20010328300 申请日期 2001.10.25
申请人 CANON ELECTRONICS INC 发明人 INOUE MAMORU
分类号 B29C45/67;B29C45/26;B29C45/38;B29C45/40;B29C45/72;(IPC1-7):B29C45/67 主分类号 B29C45/67
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