发明名称 MOTHER DIE FOR MODULE ELECTROFORMING AND METHOD FOR DUPLICATION BY ELECTROFORMING
摘要 PROBLEM TO BE SOLVED: To realize the reduction in mass and the improvement in machinability and handleability by divided processing of only a shape transfer region by devising a method for duplication by electroforming excellent in shape transfer quality, an electroforming die structure of uniform electrodepositability, an inexpensive electroforming die making method, or the like. SOLUTION: The mother die for module electroforming is one which is capable of being assembled from several blocks prepared by dividing a shape transfer region on which a fine pattern is formed and a region surrounding it and in which the shape transfer surface lies level to the blocks. Because the shape transfer region on which a fine pattern is formed is surrounded by other mother die blocks and the shape transfer region and the electroforming surface of the surrounding block form a level plane, the shape transfer region has no unlevelness around it. Therefore, concentrated deposition on the outer periphery of the shape transfer region does not occur and a plating layer uniform throughout the entire surface of the shape transfer region can be formed. As a result, the deterioration in transfer quality by concentrated deposition causing the warpage or deformation of the plating layer in the transfer region does not occur.
申请公布号 JP2003129269(A) 申请公布日期 2003.05.08
申请号 JP20010320253 申请日期 2001.10.18
申请人 RICOH CO LTD 发明人 IKEDA KUNIO
分类号 B29C33/38;C25D1/00;C25D1/10;(IPC1-7):C25D1/10 主分类号 B29C33/38
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