| 摘要 |
<p>1329506 Electroless deposition of copper BADISCHE ANILIN & SODA FABRIK A G 19 April 1971 [21 Jan 1970] 20023/71 Heading C7F A non-conducting substrate of e.g. foamed polystyrene is electroless plated with Cu, by first applying a coating of particulate Zn having an average size of less than 4 microns. The Zn is dispersed in water or alcohol containing a binder of polymeric material, and a dispersing agent. The copper plating solution is acidic (pH 0À5 to 2À0) and may contain glycine or glutamic, citric, tartaric, oxalic, sulphuric or amino sulphonic acids. The Cu may be subsequently plated with Cu, Ni, Cr, Co or Au.</p> |
